LDCW COMPUTING

New Type of AI Chip

Laser-Driven Coherent Wave

Physics Computes, Not Transistors

8×
Faster
(Target)
1/8
Energy
(Target)
~10%
Cost
(vs GPU)
0
ADC/DAC
(Required)
The Challenge

The AI Industry Has an Energy Problem

⚡

85% Energy Wasted

ADC/DAC conversion consumes 85% of AI chip power before computation even begins.

🌡️

Cooling Crisis

Data centers require liquid cooling + HVAC. Edge AI and satellite AI remain impossible.

🏭

TSMC Dependency

4nm fabrication requires $20B fabs with 6-12 month lead times. Single point of failure.

💰

Prohibitive Costs

$30,000+ per GPU. Only hyperscalers can afford serious AI compute.

Our Breakthrough

LDCW: A Fundamentally Different Approach

Eliminate ADC/DAC entirely. Let physics do the computation.

0 pJ
ADC/DAC Energy
Frequency-domain encoding keeps data in wave domain — no conversion needed.
1.5 pJ
Total Energy/Op
Target 8× improvement over GPU's 12 pJ/op. Passive cooling only.
PCB
Manufacturing
Standard PCB fabrication. No TSMC. 1000s of suppliers. 2-4 week lead time.
$50-100
Chip Cost
Target 300× cost reduction vs $30,000 GPU. Enables AI everywhere.

LDCW vs. Current Technology

FeatureNVIDIA H100LDCW (Target)
Energy per Operation12 pJ1.5 pJ
ADC/DAC Overhead~10 pJ (85%!)0 pJ
Fabrication4nm TSMC ($20B fab)Standard PCB
Lead Time6-12 months2-4 weeks
Cooling RequiredLiquid + Active HVACPassive only
Chip Cost$30,000+$50-100
Satellite/Edge AIImpossibleStandard

The Question

Someone will solve the AI energy crisis. Someone will enable AI in every device. Someone will capture a $100B+ market. Will it be you?

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